PCB Assembly Capabilities
Features
Standard PCBA
Assembly Types
Single & double sided placement (SMT/Thru-hole)
PCB Layer
1 - 32 layers
Thickness
No limit
Dimension
Single PCB Size:70x70mm - 460x500mm
PCB Panel Size:70x70mm - 250x250mm
Order Volume
2 - 80000 pcs
Surface Finish
No limit
PCB Color
No limit
Delivery Format
Single PCB, Panel with mouse bites, Panel with V-cut
Layer Stackup
All stack-up
Gold Fingers/Castellated Holes/Edge Plating
Support
Edge Rails
Necessary
Necessary
Fiducials
Minimum IC Pin Spacing
0.35mm
Minimum BGA Spacing
0.35mm(center to center)
Reflow temperature
240+/-5 °C
SPI
Yes
AOI
Yes
Yes
Visual Inspection
X-ray Inspection
Yes (only for certain parts, such as BGA)
PCB Specifications
Description
Features
Capability
Layer count
1-32 Layers
The number of copper layers in the PCB
Controlled Impedance
4/6/8/10/12/14/16/18/20/.../32 layers
The desired impedance. The range of accepted values is 20 to 90 Ω for single-ended and 50 to 150 Ω for differential signals.
Impedance Tolerance
±10%
Material
FR-4
Grade A laminates from suppliers including Nan Ya, KB, Shengyi and etc.
FR-4 Dielectric Constants
4.5 (2-Layer PCB)
7628 Prepreg 4.4
3313 Perpreg 4.1
2116 Perpreg 4.16
Maximum Dimensions
FR4 PCB: 670 × 600 mm
These limits apply to PCBs with thickness ≥ 0.8 mm. The thinner FR4 PCBs are 500 × 600 mm maximum. 2-layer FR4 PCBs can reach a maximum size of 1020 × 600 mm.
Minimum Dimensions
Regular: 3 × 3 mm. Castellated / Plated Edges: 10 × 10 mm.
These limits apply to PCBs with thickness ≥ 0.6 mm. Manual review required for thinner PCBs. Panelization is recommended for small-sized boards.
Dimension Tolerance
±0.1mm
Thickness
0.4 - 4.5 mm
Board thickness Tolerance
T≥1.0mm：±10%
T<1.0mm：±0.1mm
±0.1mm(Precision) and ±0.2mm(Regular) for CNC routing, and ±0.4mm for V-scoring
Thickness for FR4 are: 0.4/0.6/0.8/1.0/1.2/1.6/2.0 mm (2.5 mm and above are for 12+ layer PCBs only)
Finished Outer Layer Copper
1 oz / 2 oz (35um / 70um)
Finished copper weight of outer layer is 1oz or 2oz.
Finished Inner Layer Copper
0.5 oz / 1 oz / 2 oz (17.5um / 35um / 70um)
Finished copper weight of inner layer is 0.5oz by default.
Soldermask
Green, Purple, Red, Yellow, Blue, White, and Black.
We use LPI (Liquid Photo Imageable) solder mask. This is the most common type of mask used today. Heat-cured ink soldermask is usually found on low-cost, single-sided PCBs.
Surface Finish
HASL (leaded / lead-free), ENIG, OSP (copper core boards only)
FR4 has all three finishes available, 6+ layers and RF boards only have ENIG.
HDI
Structure
Any Layer(10L)
Width/Space(Outer Layer)
2.5mil/2.5mil
Patterns
POFV(VIPPO), Plane Hybrid, Partial Hybrid, Step/Section Gold Finger, Cavity, Back-drilling, Edge Plating, Embedded Chip/Discrete Device, Embedded Plane Capacitor/Resistor, N+N Structure(Belly-Belly), Mechanical Blind Hole with Double-side Press-fit, Partial Heavy Copper, High Temp. Lamination without Prepreg, Copper/Silver Filled, Skip via
Drilling
Description
Features
Capability
Drill Diameter
1-layer: 0.3 – 6.3 mm
2-layer: 0.15 – 6.3 mm
Multilayer: 0.15 – 6.3 mm
Holes with diameter ≥ 6.3 mm are CNC routed from a smaller drilled hole.
Min. drill diameter for 2- or more-layer PCBs is 0.15 mm (more costly!)
Hole size Tolerance (Plated)
Through-holes: +0.13 / -0.08 mm
Press-fit holes：±0.05 mm (multilayer ENIG boards only – mention the specific holes in PCB Remark)
e.g. for the 0.6mm hole size, the finished hole size between 0.52mm to 0.73mm is acceptable.
Hole size Tolerance (Non-Plated)
±0.2mm
e.g. for the 1.00mm Non-Plated hole, the finished hole size between 0.80mm to 1.20mm is acceptable.
Average Hole Plating Thickness
18μm
Blind/Buried Vias
Supported
Patterns
Min. Via hole size/diameter
0.15mm / 0.25mm
1-layer (NPTH only): 0.3 mm hole size / 0.5 mm via diameter
Multilayer: 0.15 mm hole size / 0.25 mm via diameter
① Via diameter should be 0.1mm(0.15mm preferred) larger than Via hole size.
② Preferred Min. Via hole size: 0.2mm
Min. Non-plated holes
0.50mm
Please draw NPTHs in the mechanical layer or keep out layer.
Min. Plated Slots
0.5mm
The minimum plated slot width is 0.5mm, which is drawn with a pad.
Min. Non-Plated Slots
1.0mm
The minimum Non-Plated Slot Width is 1.0mm, please draw the slot outline in the mechanical layer(GM1 or GKO)
Via Hole-to-Hole Spacing
0.2mm
Pad Hole-to-Hole Spacing
0.45mm
Min. Castellated Holes
0.5mm
Castellated holes are metalized half-holes on PCB edges, commonly used on daughter boards to be soldered onto carrier PCBs.
① Hole diameter (Φ): ≥ 0.5 mm
② Hole to board edge (L): ≥ 1 mm
③ Hole to hole (D): ≥ 0.5 mm
④ Min. PCB size：10 × 10 mm
⑤ Min. PCB thickness: 0.6 mm
Plated Edges
10 x 10mm
Plated edges are copper-plated and ENIG treated. HASL is not supported.
① Min. PCB size: 10 × 10 mm
② Min. PCB thickness: 0.6 mm
③ At least 3 breaks (more for larger PCBs) in the edge plating are required for support tab connections
Blind Slot
① Blind slot width (W): ≥1.0mm
② Blind slot depth (D): ≥0.2mm
③ Blind slot annular width (A): ≥0.3mm (The pad width of PTH blind slots)
④ Safety distance (S): ≥0.2mm (The distance from NPTH blind slots to pad/traces/copper plane)
⑤ Blind slot remaining thickness (R): ≥0.2mm (The distance from the bottom of the blind slot to the nearest inner copper layer/surface substrate)
⑥ Supports 2-32 layer FR4 boards with a thickness of ≥0.8mm
Rectangular Holes / Slots
Not supported
Rectangular holes and slots without rounded corners are not supported.
Traces
Description
Features
Capability
Min. track width and spacing (1 oz)
0.10 / 0.10 mm (4 / 4 mil)
1- and 2-layer: 0.10 / 0.10 mm (4 / 4 mil)
Multilayer: 0.09 / 0.09 mm (3.5 / 3.5 mil). 3 mil is acceptable in BGA fan-outs.
Min. track Width and Spacing (2 oz)
0.16 / 0.16 mm (6.5 / 6.5 mil)
2-layer: 0.16 / 0.16 mm (6.5 / 6.5 mil)
Multilayer: 0.16 / 0.20 mm (6.5 / 8 mil)
Track width Tolerance
±20%
e.g. For a 0.1 mm track, the finished track width ranges from 0.08 and 0.12 mm.
PTH Annular Ring
≧0.20mm
2-Layer:
1 oz: Recommended 0.25 mm or above; absolute minimum 0.18 mm
2 oz: 0.254 mm or above
Multi-Layer:
1 oz: Recommended 0.20 mm or above; absolute minimum 0.15 mm
2 oz: 0.254 mm or above
NPTH Pad Annular Ring
≧0.45mm
Recommended 0.45 mm or more. This is to allow a 0.2 mm ring of copper to be removed around the hole for the sealing film to attach. Pad sizes smaller than the recommended value can result in the annular ring being very thin or completely missing.
BGA
0.25mm
① BGA pad diameter ≥ 0.25 mm
② BGA pad to trace clearance ≥ 0.1 mm (min. 0.09 mm for multilayer boards)
③ Vias can be placed within BGA pads using filled and plated-over vias
Trace coils
0.15/0.15mm
Minimum trace width/clearance: 0.15/0.15mm, when traces are covered by solder mask (1oz).
Minimum trace width/clearance: 0.25/0.25mm, when traces are NOT covered by solder mask (1oz). ENIG only(high risk of short circuit with HASL)
Hatched grid width and spacing
0.25 mm
Same-net track spacing
0.25mm
Inner layer via hole to copper clearance
0.2mm
Inner layer PTH pad Hole to Copper Clearance
0.3mm
Pad to track clearance
0.1mm
Min. 0.1 mm (stay well above if possible). Min. 0.09 mm locally for BGA pads
SMD Pad to Pad Clearance (Different Nets)
0.15mm
Via Hole to Track
0.2mm
PTH to Track
0.28mm
0.35mm is recommended, minimum 0.28mm
NPTH to Track
0.2mm
Patterns
